pcb 1.1 issues
- flip D3 to match D1/D2
- heatsink hole sizes
- power sw mounting holes need to be plated
- big pin 1 marker for the led driver on the back
- improve routing regarding MOR
- remove stupid dot from power sw, put on/off on silk
- move power jack back a few mil
- move usb jack back a bit
- why is c32 where it is?
- vent slots under heatsink?
- test points
- C13 footprint probably still too small
- change heatsink slots to drills
- remove dot from sdcard footprint
- tighten up filters again...
- add TPs for EX_A and EX_B
- decrease gain at audio amp