pcb 1.1 issues
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flip D3 to match D1/D2 -
heatsink hole sizes -
power sw mounting holes need to be plated -
big pin 1 marker for the led driver on the back -
improve routing regarding MOR -
remove stupid dot from power sw, put on/off on silk -
move power jack back a few mil -
move usb jack back a bit -
why is c32 where it is? -
vent slots under heatsink? -
test points -
C13 footprint probably still too small
...
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change heatsink slots to drills -
remove dot from sdcard footprint -
tighten up filters again... -
add TPs for EX_A and EX_B -
decrease gain at audio amp